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Modern electronic devices, especially during heavy use or in high temperature environments, generate significant heat. This excessive heat generation leads to several critical issues such as device performance degradation due to thermal throttling and causing discomfort to the user. To address this problem, an external cooling solution is proposed by developing an add-on device using a Thermoelectric Cooler (TEC) module. The main objective of this study is to design and test a cooling system that is capable of actively achieving low temperatures on the surface of the electronic device. This system incorporates a TEC module supported by a liquid-based cooling system to remove heat from the hot side more efficiently, thus allowing the cold side to reach a much lower temperature. By directly cooling the external surface of the device, heat from the internal components of the main heat generator such as the Central Processing Unit (CPU) can be removed more effectively. This solution is expected to control and limit the operating temperature of the entire electronic device, thereby maintaining optimal performance and improving user comfort during long or heavy usage sessions.

Keywords: Thermoelectric Cooler (TEC), Liquid Cooling, Thermal Management, Electronic Devices, Thermal Deceleration, Active Cooling.